STI provides comprehensive through-life support packages to its customers.
We have over 30 year’s experience providing a full through-life support service, which covers full product reconditioning, product upgrades or repair, for our customers. We also provide training and in-country investigation and repair as required.
With a dedicated Customer Account Manager and purpose designed Return Material Authorisation (RMA) system our team is dedicated to ensuring a fast and proficient turnaround.
Our service level agreements can be tailored to your specific requirements with the additional option to extended product warranty. Our aim is to maximise the life of our customer’s products and systems.
Key Capabilities
- Dedicated Customer Account Manager
- On-site support team
- Reporting in accordance with customer support agreement
- Support agreements with third-party vendors
- Buffer stock and material management
- Risk and Obsolescence Management
- Control of Cryptographic material by certified custodians
- Professionally qualified engineers and technicians
- Extensive range of test and diagnostic equipment
Repair Capabilities
General Rework Procedures
- Solder Joint Touch-Up
- X-ray Inspection
- Thermal Profiling & Preheating
- Coating Removal & Reapplication
Circuit & Laminate Repairs
- Reattachment or replacement of lifted pads or tracks.
- Plated Hole Repair – Restoration of damaged vias and through-holes.
- Laminate Repair – Filling and sealing of damaged PCB substrate areas.
Component-Level Repairs
- Lead-Free & SnPb Compatibility – Procedures adapted for both solder types.
- Through-Hole Component Replacement – Removal and installation of connectors, headers, and other PTH components.
- BGA Rework & Installation – Using our dedicated BGA rework machine, we perform precise removal, reballing, and fitting of Ball Grid Array components.
- Surface Mount Device Replacement – Including chip components, SOICs and QFPs.
Assembly Modifications
- Jumpers & Wire Adds – Adding wires to reroute or restore connections.
