Our manufacturing and test capabilities
in Hook include:
- Surface Mount assembly – Using ASM Siplace and Mydata pick-and-place machines, we can operate down to 01005, 0.25mm BGA and 30um accuracy. We have 5 lines with a combined capability of over 200,000 components per hour
- Conventional through-hole assembly – Customer-focused teams manage a product through final assembly to IPC-A-610 and J-STD-001 Class 3 standard. We have lead-free and tin-lead capability
- Wavesolder and Selective Solder – Capability in both lead-free and tin-lead solder alloy
- Vacuum vapour-phase soldering – STI was the first UK CEM to use this technique. It gives a high integrity joint which is virtually void free. The soldering atmosphere is inert so that oxidation is eliminated to produce “perfect” joints
- Test – We have extensive test facilities utilising many industry standard platforms: Takaya roving probe, J-Tag, X-Jtag, Goepel and Asset boundary scan, Teradyne and Aeroflex ICT, Aeroflex and National Instruments functional test. We will design and implement test solutions for our customers
- Environmental Testing – 9 ESS chambers with liquid nitrogen cooling. 2 chambers have additional random vibration capability for highly accelerated life testing (HALT)
- Box-Build and Test – Dedicated facilities can accommodate activities ranging from low-volume aircraft wiring to IPC-A-620 standard to medium-volume assembly and test. Bespoke cells are designed and laid out to provide the best process flow for each product
- State-of-the-art screened RF room – With greater than 90dB isolation at 1GHz to RF signals, we have a clean RF environment that delivers great accuracy of test results with repeatability and complete reliability
- RF N-type bulkhead connectors allow the RF test signals to safely penetrate the metal-screened room without compromising the shielding integrity
- Waveguide feed-through with a fibre optic interface allows non-galvanic connections with the device under test, if necessary
- Abundant supply of mains filtered sockets on the inside of the room with honeycomb-type shielded air vents to permit smooth airflow through the filter, whilst also preventing any RF penetration
- Coating and Encapsulation – We are capable of handling a huge variety of materials and techniques from spray coating, dip coating to potting, encapsulation and robotic underfill. Our engineers will design a process to suit the needs of the product
- Special Processes – We have a technology centre with operators skilled in IPC-7711/21 to support specialist needs. Services include BGA re-balling, specialist modifications, X-Ray and XRF analysis and micro-section
- Product Support – A dedicated facility for supporting legacy products, spares and repairs and out-of-warranty product test, repair and refurbishment
