Ball Grid Array Facilities In-House

A dedicated facility for intricate or technically complex modification to existing designs, can support repairs as well as chip changes (including all types of area array packages) and upgrades, with extensive tools including both hot air and IR BGA rework stations

• Fein Focus X-Ray
  • Real-Time Microfocus Digital X-Ray with Oblique Angle Viewing
  • Detects Solder Voids, Wetting & Short Circuits
  • Auto Measuring for Diameter of Solder Joints and Micro Via Alignment.
    
    
• Ersascope
  • Inspects solder joints under components

Please contact us for further information.