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In recent years the biggest challenge in surface mount assembly has been the introduction of the ball grid array (bga) package and it’s finer pitch derivatives. STI  started along this learning curve way back in 1995, much earlier than most, to discover how the technology impinges on most aspects of processing but sets particular challenges in the inspection and rework of the bga devices. STI  has always invested in leading edge technology and none more so than in bga because without real-time x-ray, ersascope, pick & place cameras, specialised rework and re-balling equipment it is impossible to qualify and run a bga process with complete reliability and repeatability.

Largest bga placed 1580 balls, 55mm x 55mm

Smallest bga 0.2mm pitch

Fein Focus X-Ray, 600x magnification, 2µ resolution

Ersascope for inspection underneath bga’s

 OKI BGA Re-Work Stations

Siemens Siplace Pick & Place bga camera systems